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AlN Chips Copper Sputtering Depostion System, Aluminum Nitride Copper Direct Plating Machine

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AlN Chips Copper Sputtering Depostion System, Aluminum Nitride Copper Direct Plating Machine

Brand Name : ROYAL

Model Number : RTAS1215

Certification : CE certification

Place of Origin : Made in China

MOQ : 1 set

Price : negotiable

Payment Terms : L/C, D/A, D/P, T/T

Supply Ability : 6 sets per month

Delivery Time : 12 weeks

Packaging Details : Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.

Deposition Sources : Magnetron DC / MF Sputtering + Steered Cathodic Arc

Deposition Films : Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

Applications : LED Ceramic Chips with Cooper Plating, Al2O3, AlN ceramic circuit boards, Al2O3 plates on LED, semiconductor

Film Features : wear resistance, strong adhesion, decorative coating colors

Factory Location : Shanghai city, China

Worldwide Service : Poland - Europe; Iran- West Asia & Middle East, Turkey, India, Mexico- South America

Training Service : Machine operation, maintenance, coating process Recipes, program

Warranty : Limited warranty 1 year for free, whole life for machine

OEM & ODM : available, we support tailor made design and fabrication

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AlN Chips Copper Sputtering Depostion System, Aluminum Nitride PVD Copper Sputtering Machine

Performance

1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.

2. Operating Vacuum Pressure: 1.0×10-4 Torr.

3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)

4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

5. Operating Model: Full Automatically /Semi-Auto/ Manually

Structure

The vacuum coating machine contains key completed system listed below:

1. Vacuum Chamber

2. Rouhging Vacuum Pumping System (Backing Pump Package)

3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump)

4. Electrical Control and Operation System

5. Auxiliarry Facility System (Sub System)

6. Deposition System

Copper Sputtering Coating Machine Key Features

1. Equipped with 8 steer arc cathodes and DC Sputtering Cathodes, MF Sputtering Cathodes, Ion source unit.

2. Multilayer and co-deposition coating available

3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion.

4. Ceramic/ Al2O3/AlN substrates heating up unit;

5. Substrate rotation and revolution system, for 1-side coating and 2-sides coating.

AlN Chips Copper Sputtering Depostion System, Aluminum Nitride Copper Direct Plating Machine

Cooper Magnetron Sputtering Coating Plant on Ceramic Radiating Substrate

The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate.

Cooper conductive film deposition on Al2O3, AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing methods: DBC LTCC HTCC, much lower production cost is its high feature.

Royal technology team assited our customer to developed the DPC process sucessfully with PVD sputtering technology.

The RTAC1215-SP machine designed exclusively for Copper conductive film coating on Ceramic chips, ceramic circuit board.

AlN Chips Copper Sputtering Depostion System, Aluminum Nitride Copper Direct Plating Machine

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.


Product Tags:

pvd coating system

      

titanium coating machine

      
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